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Transcend MTE662T2 256 GB Solid State Drive - M.2 2280 Internal - PCI Express NVMe (PCI Express NVMe 3.0 x4)

SKU: TS256GMTE662T2

Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20?~75?.

Technologies

  • 96-layer 3D NAND Flash
  • 30µ" PCB Gold Finger
  • Corner Bond
  • Extended Temperature
  • Dynamic Thermal Throttling
  • Thermal Sensor
  • Read Disturbance
  • Garbage Collection
  • Wear Leveling
  • TRIM
  • Bad Block Management
  • Early Move

Firmware Features

  • Supports NVM command
  • SLC caching technology
  • Dynamic thermal throttling
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
  • Full drive encryption with Advanced Encryption Standard (AES) (optional)

Hardware Features

  • Compliant with RoHS 2.0 standards
  • Compliant with NVM Express specification 1.3
  • Compliant with PCI Express specification 3.1
  • Space-saving M.2 form factor (80mm) - ideal for mobile computing devices
  • PCIe Gen 3 x4 interface
  • DDR4 DRAM Cache embedded
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Key components fortified by default with Corner Bond technology
  • 30µ" PCB gold finger
  • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
  • Supports Transcend Scope Pro software
  • Is power and energy-efficient to ensure maximum reliability
  • Internal drive type for a reliable and convenient storage solution
  • With a capacity of 256 GB, you have large storage space for all your documents and data
  • PCI Express NVMe 3.0 x4 interface ensures quick and reliable data transfer
  • M.2 2280 form factor for added reliability and dependability

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Regular price $86.99

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Details

Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20?~75?.

Technologies

  • 96-layer 3D NAND Flash
  • 30µ" PCB Gold Finger
  • Corner Bond
  • Extended Temperature
  • Dynamic Thermal Throttling
  • Thermal Sensor
  • Read Disturbance
  • Garbage Collection
  • Wear Leveling
  • TRIM
  • Bad Block Management
  • Early Move

Firmware Features

  • Supports NVM command
  • SLC caching technology
  • Dynamic thermal throttling
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
  • Full drive encryption with Advanced Encryption Standard (AES) (optional)

Hardware Features

  • Compliant with RoHS 2.0 standards
  • Compliant with NVM Express specification 1.3
  • Compliant with PCI Express specification 3.1
  • Space-saving M.2 form factor (80mm) - ideal for mobile computing devices
  • PCIe Gen 3 x4 interface
  • DDR4 DRAM Cache embedded
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Key components fortified by default with Corner Bond technology
  • 30µ" PCB gold finger
  • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
  • Supports Transcend Scope Pro software
  • Is power and energy-efficient to ensure maximum reliability
  • Internal drive type for a reliable and convenient storage solution
  • With a capacity of 256 GB, you have large storage space for all your documents and data
  • PCI Express NVMe 3.0 x4 interface ensures quick and reliable data transfer
  • M.2 2280 form factor for added reliability and dependability
Specifications
Compatibility:
  • Intel Mini PC BKNUC9VXQNX
  • Intel Mini PC BKNUC9VXQNX2
Device Supported:
Desktop PC
Drive Interface:
PCI Express NVMe
Drive Interface Standard:
PCI Express NVMe 3.0 x4
Drive Type:
Internal
Endurance (DWPD):
2
Environmentally Friendly:
Yes
Environmental Compliance:
Restriction of Hazardous Substances (RoHS) 2
Form Factor:
M.2 2280
Length:
3.1"
Limited Warranty:
3 Year
Manufacturer:
Transcend Information, Inc
Manufacturer Website Address:
http://www.transcend-info.com
Product Model:
MTE662T2
Product Type:
Solid State Drive
Storage Capacity:
256 GB
Wireless LAN:
No

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Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20?~75?.

Technologies

  • 96-layer 3D NAND Flash
  • 30µ" PCB Gold Finger
  • Corner Bond
  • Extended Temperature
  • Dynamic Thermal Throttling
  • Thermal Sensor
  • Read Disturbance
  • Garbage Collection
  • Wear Leveling
  • TRIM
  • Bad Block Management
  • Early Move

Firmware Features

  • Supports NVM command
  • SLC caching technology
  • Dynamic thermal throttling
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
  • Full drive encryption with Advanced Encryption Standard (AES) (optional)

Hardware Features

  • Compliant with RoHS 2.0 standards
  • Compliant with NVM Express specification 1.3
  • Compliant with PCI Express specification 3.1
  • Space-saving M.2 form factor (80mm) - ideal for mobile computing devices
  • PCIe Gen 3 x4 interface
  • DDR4 DRAM Cache embedded
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Key components fortified by default with Corner Bond technology
  • 30µ" PCB gold finger
  • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
  • Supports Transcend Scope Pro software
  • Is power and energy-efficient to ensure maximum reliability
  • Internal drive type for a reliable and convenient storage solution
  • With a capacity of 256 GB, you have large storage space for all your documents and data
  • PCI Express NVMe 3.0 x4 interface ensures quick and reliable data transfer
  • M.2 2280 form factor for added reliability and dependability